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	Home	Technical supportCareersContactSite MapPartners SPiD: a unique solution to secure ID Documents
	The ASK SPiD is a comprehensive contactless solution specifically designed for ID documents. SPiD is available as a paper or Teslin inlay to be inserted into a cover or as a polycarbonate inlay to be embedded within a datapage of electronic passport. ASK core technology is based on silver antenna and a die chip process combining advantages that have been field proven with contactless cards and tickets. SPID e-Cover are based on ASK technology. This allows to produce very thin inlays due to chip thickness, made of paper, Teslin, or polycarbonate materials. SPID e-Cover packaging for the e-passport has been tested with many national printing companies. This ICAO compliant solution can be added to new passports without changing the existing passport manufacturing process. SPID e-Cover successfully went through extensive mechanical tests including torsion, bending and stamp tests, or temperature and humidity tests. SPID e-Cover packaging benefits from an innovative manufacturing process. The RF antenna is printed directly on a paper substrate. Adding a die chip, the end product is less than 350µm thick, the thinnest available solution, while benefiting from outstanding mechanical characteristics. Download SPiD PDF product sheet
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